Shen-Li Fu,: search on Z-Library

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1

The NTC thermistor fabricated by boundary-layer technology

In-Chyuan Ho, Shen-Li Fu

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1990

Language:

english

File:

PDF, 606 KB

english, 1990

2

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging

Ying-Chih Wu,, Yu-Jung Huang,, Ming-Kun Chen,, Yi-Lung Lin,, Shen-Li Fu,

Year:

2012

Language:

english

File:

PDF, 3.09 MB

english, 2012

3

Thermal Placement Design for MCM Applications

Huang, Yu-Jung, Fu, Shen-Li

Journal:

Journal of Electronic Packaging

Year:

2000

Language:

english

File:

PDF, 433 KB

english, 2000

4

A miniaturized bandpass filter fabricated on high dielectric constant ceramic substrates

Ming-Liang Hsieh, Tsung-Hui Huang, Lih-Shan Chen, Chian-Hao Sun, Shuming Wang, Mau-Phon Houng, Shen-Li Fu

Journal:

Microwave and Optical Technology Letters

Year:

2007

Language:

english

File:

PDF, 198 KB

english, 2007

5

Oxidation, microstructure and metallization of aluminum nitride substrates

Wenjea J. Tseng, Chir-Jang Tsai, Shen-Li Fu

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2000

Language:

english

File:

PDF, 247 KB

english, 2000

6

A conduction model for BaPbO/sub 3/-based thick film resistors

Yu-Hung Hsieh,, Shen-Li Fu,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 395 KB

english, 1994

7

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates

Hsieh, Ming-Liang, Chen, Lih-Shan, Wang, Shuming, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 1.41 MB

english, 2006

8

Fabrication of amorphous silicon films for arrayed waveguide grating application

Wen-Jen Liu, Steven Chen, Hsin-Yen Cheng, Jyung-Dong Lin, Shen-Li Fu

Journal:

Surface and Coatings Technology

Year:

2007

Language:

english

File:

PDF, 565 KB

english, 2007

9

Porosity development of RuO2filled glass thick films on aluminum nitride substrates at elevated temperatures

Wenjea J. Tseng, Chir-Jang Tsai, Shen-Li Fu

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2000

Language:

english

File:

PDF, 195 KB

english, 2000

10

Low firing Z5U relaxor multilayer ceramic capacitor

Chen Gung-Fu, Fu Shen-Li

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1988

Language:

english

File:

PDF, 399 KB

english, 1988

11

Failure analysis of EOS-induced damage at final electrical testing

Chen, Ming-Kun, Huang, Yu-Jung, Cheng, Chi-Chan, Lin, Yi-Lung, Fu, Shen-Li

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 655 KB

english, 2014

12

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication and characterization of ultrathin fine-pitch flexible polyimide interposer

Wei-Han Huang,, Chun-Yi Wang,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2015

Language:

english

File:

PDF, 984 KB

english, 2015

13

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process

Hsiang-Chen Hsu,, Wei-Yaw Chang,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2007

Language:

english

File:

PDF, 765 KB

english, 2007

14

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Reliability and wear-out characterization of BGA production sockets

Hou Shu-Jung,, Huang Yu-Jung,, Chen Ming-Kun,, Fu Shen-Li,

Year:

2008

Language:

english

File:

PDF, 3.58 MB

english, 2008

15

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer

Pei-Chieh Chin,, Chin-Yuan Hu,, Hsiang-Chen Hsu,, Shen-Li Fu,, Chang-Lin Yeh,, Yi-Shao Lai,

Year:

2007

Language:

english

File:

PDF, 896 KB

english, 2007

16

Digital games for learning energy conservation: A study of impacts on motivation, attention, and learning outcomes

Chen, Szu-Wei, Yang, Chih-Hui, Huang, Keng-Shiang, Fu, Shen-Li

Journal:

Innovations in Education & Teaching International

Year:

2017

Language:

english

File:

PDF, 942 KB

english, 2017

17

Low-temperature sintering of PZT ceramics

Syh-Yuh Cheng, Shen-Li Fu, Chung-Chuang Wei

Journal:

Ceramics International

Year:

1987

Language:

english

File:

PDF, 1.05 MB

english, 1987

18

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Yeh, Chang-Lin, Lai, Yi-Shao

Year:

2008

Language:

english

File:

PDF, 4.01 MB

english, 2008

19

Fabrication and characterization of low-cost ultrathin flexible polyimide interposer

Huang, Yu-Jung, Chen, Ming-Kun, Lin, Yi-Lung, Fu, Shen-Li

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.26 MB

english, 2015

20

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model

Chang, Wei-Yao, Hsu, Hsiang-Chen, Fu, Shen-Li, Lai, Yi-Shao, Yeh, Chang-Lin

Year:

2008

Language:

english

File:

PDF, 4.12 MB

english, 2008

21

Orientation of CdTe epitaxial films on GaAs(100) grown by vacuum evaporation

Mau-Phon Houng, Shen-Li Fu, Fenq-Lin Jenq, Jiann-Ruey Chen

Journal:

Thin Solid Films

Year:

1991

Language:

english

File:

PDF, 347 KB

english, 1991

22

Reliability and routability consideration for MCM placement

Yu-Jung Huang, Mei-Hui Guo, Shen-Li Fu

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 209 KB

english, 2002

23

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications

Hsiao, Sheng-Feng, Chen, Ming-Kun, Lin, Yi-Lung, Huang, Yu-Jung, Fu, Shen-Li

Year:

2011

Language:

english

File:

PDF, 676 KB

english, 2011

24

Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3

Ming-Liang Hsieh, Lih-Shan Chen, Hsiang-Chen Hsu, Shuming Wang, Mau-Phon Houng, Shen-Li Fu

Journal:

Materials Research Bulletin

Year:

2008

Language:

english

File:

PDF, 781 KB

english, 2008

25

[IEEE 2009 IEEE International Workshop on Antenna Technology "Small Antennas and Novel Metamaterials" (iWAT) - Santa Monica, CA, USA (2009.03.2-2009.03.4)] 2009 IEEE International Workshop on Antenna Technology - Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array

Hsien-Chiao Teng,, Yen-ting Yang,, Shen Cherng,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2009

Language:

english

File:

PDF, 310 KB

english, 2009

26

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal design for high power arrayed LED heat-dissipating system

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Li, Jyun-Yi, Su, Jing-Wen, Huang, Jian-Siang, Fu, Shen-Li

Year:

2013

Language:

english

File:

PDF, 1.24 MB

english, 2013

27

Sintering of cordierite glass-ceramic with lead borosilicate glass

Shen-Li Fu, Lih-Shan Chen, Jung-Hua Chou

Journal:

Ceramics International

Year:

1994

Language:

english

File:

PDF, 8.53 MB

english, 1994

28

The NTCR effect of V2O5-doped (Ba0.8Sr0.2)(Ti0.9Zr0.1)O3ceramics

Shen-Li Fu, In-Chyuan Ho

Journal:

Journal of Materials Science Letters

Year:

1989

Language:

english

File:

PDF, 567 KB

english, 1989

29

Thick film resistor fabricated with YBa2Cu3O 7-x superconducting powder

Fu Shen-Li, Hsieh Yu-Hung

Journal:

IEEE Transactions on Components Hybrids and Manufacturing Technology

Year:

1991

Language:

english

File:

PDF, 450 KB

english, 1991

30

Low Temperature Sintering of P 2 O 5 -Added Cordierite Glass with Borosilicate Glass

Fu, Shen-Li, Chen, Lih-Shan

Journal:

Japanese Journal of Applied Physics

Year:

1993

File:

PDF, 559 KB

1993

31

Micro-Pattern Fabrication for Medical Device Applications

Huang, Yu-Jung, Pan, Chung-Long, Chen, Po-Ying, Fu, Shen-Li

Journal:

Nanoscience and Nanotechnology Letters

Year:

2015

Language:

english

File:

PDF, 4.52 MB

english, 2015

32

Current Noise of Resin Type and Cermet Type Thick Film Resistors

Fu, Shen-Li, Shiramatsu, Toyotaro, Wu, Tien-Shou

Journal:

ElectroComponent Science and Technology

Year:

1980

Language:

english

File:

PDF, 1.88 MB

english, 1980

33

Harmonic suppression of bandpass filters using open-circuited stubs

Lih-Shan Chen, Wen-Jeng Lin, Tsung-Hui Huang, Mau-Phon Houng, Shen-Li Fu

Journal:

Microwave and Optical Technology Letters

Year:

2008

Language:

english

File:

PDF, 277 KB

english, 2008

34

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Chiang, Huann-Wu, Chung, Cho-Liang, Chen, Liu-Chin, Li, Yi, Wong, C. P., Fu, Shen-Li

Journal:

Journal of Adhesion Science and Technology

Year:

2005

Language:

english

File:

PDF, 2.45 MB

english, 2005

35

The Core-Shell Grain Resistance in the Reduced La-Doped (Ba, Sr)TiO 3 Ceramics

Ho, In-Chyuan, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

1990

File:

PDF, 1.06 MB

1990

36

Fabrication of perovskite Pb(Fe 1/2 Nb 1/2 )O 3 and reaction mechanism

Fu, Shen-Li, Chen, Gung-Fu

Journal:

Year:

1988

Language:

english

File:

PDF, 411 KB

english, 1988

37

[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Loopback test for 3D stacked integrated circuits

Huang, Yu-Jung, Liu, Yan-Cen, Fu, Shen-Li

Year:

2015

Language:

english

File:

PDF, 679 KB

english, 2015

38

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Suppression of Spurious Resonance by Using Multistep Transmission Lines

Luo, Wen-Tsung, Lin, Wen-Jeng, Lee, Kuan-Te, Chen, Lih-Shan, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 1.12 MB

english, 2006

39

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

Hsu, Hsiang-Chen, Fu, Chih-Chiang, Chang, Hong-Shen, Fu, Shen-Li, Kung, Huang-Kuang

Year:

2010

Language:

english

File:

PDF, 218 KB

english, 2010

40

Pb(Zr0.52Ti0.48)O3ceramics sintered with Li2CO3and Na2CO3: improvement of characteristics

Syh-Yuh Cheng, Shen-Li Fu

Journal:

Journal of Materials Science

Year:

1986

Language:

english

File:

PDF, 525 KB

english, 1986

41

Fuzzy thermal modeling for MCM placement

Yu-Jung Huang, Shen-Li Fu, Sun-Lon Jen, Mei-hui Guo

Journal:

Microelectronics Journal

Year:

2001

Language:

english

File:

PDF, 203 KB

english, 2001

42

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Welcome message from Shen-Li Fu, conference co-chair

Year:

2009

Language:

english

File:

PDF, 619 KB

english, 2009

43

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation

Hsiang-Chen Hsu,, Jih-Hsin Chien,, Li-Ming Chu,, Shin-Pon Ju,, Yu-Ting Feng,, Shen-Li Fu,

Year:

2012

Language:

english

File:

PDF, 798 KB

english, 2012

44

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Study of contact degradation in final testing for BGA socket

Hsien-Chiao Teng,, Ming-Kun Chen,, Chia-Hao Yeh,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2007

Language:

english

File:

PDF, 9.08 MB

english, 2007

45

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA

Chen, Ming-Kun, Huang, Yu-Jung, Hou, Shu-Jung, Chen, Yu-Hung, Yang, Chien-Kai, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 3.00 MB

english, 2006

46

Low Temperature Sintering of P 2 O 5 -Added Cordierite Glass with Lead Borosilicate Glass

Chen, Lih-Shan, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

1992

Language:

english

File:

PDF, 344 KB

english, 1992

47

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Study of high dielectric constant capacitors on flexible substrates

Chang, Hung-Ming, Wu, Meng-Lun, Chen, Lih-Shan, Huang, Yu-Jung, Fu, Shen-Li

Year:

2010

Language:

english

File:

PDF, 201 KB

english, 2010

48

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball

Hsu, Hsiang-Chen, Lu, Jie-Rong, Yue-Min Wan,, Fu, Shen-Li

Year:

2010

Language:

english

File:

PDF, 968 KB

english, 2010

49

[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fabrication of fine pitch copper patterns on flexible substrate

Huang, Wei-Han, Yang, Kai Wei, Huang, Yu-Jung, Fu, Shen-Li

Year:

2014

Language:

english

File:

PDF, 910 KB

english, 2014

50

[IEEE 2008 Asia Pacific Microwave Conference - Macau (2008.12.16-2008.12.20)] 2008 Asia-Pacific Microwave Conference - Application of organic thin film parasitic to patch antenna

Hsien-Chiao Teng,, Shen Cherng,, Anchi Yeh,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2008

Language:

english

File:

PDF, 120 KB

english, 2008

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